The Sixth Meeting on
Fault-Tolerant Spaceborne Computing Employing New Technologies, 2013

CSRI Building
Sandia National Laboratories, Albuquerque, NM
May 28-30, 2013

Organized by: JPL, Sandia, USC/ISI, OGA

Sequestration and Federal travel restrictions will have several effects on the meeting. The organizers believe it is likely to take place, yet it should be considered "tentative" for the time being. The meeting will have a similar organization to previous years, although with additional working group session Thursday evening. Video teleconference participation will be given increased support; please contact the organizers if this is important to you.

Click here for the schedule. For reference, here are the links to the 2012, 2011, 2010, 2009 and 2008 conference archives.

Organizers

Marti Bancroft, ConsultantLarry Bergman, JPL
Steve Crago, USC/ISIErik DeBenedictis, Sandia
Mitch Fletcher, Honeywell 

ANOUNCEMENT

This is advance notice of and issue a call for participation for the sixth technical interchange meeting on space computing. The main sessions are May 29-30, 2013, with working group sessions May 28, in Albuquerque. Details will appear on this website as time progresses.

Like previous years, the topic will be R&D for next generation spacecraft computing systems, including hardware, software, and cross-cutting issues such as trust.

SOLICITATION FOR PRESENTATIONS

This year, the meeting will be focused on multi-organizational projects and collaborative R&D that could contribute to building space processors. The organizers are issuing through this page an invitation for presentations on projects or capabilities. Please respond via e-mail to any of the organizers and include a semi-formal proposal.

WORKING GROUPS AND SOLICITATION FOR OTHER WORKING GROUPS

We will have working groups as in past years. Some working groups have been organized already and we are soliciting ideas and participation in organizing others: The conference has a capacity for other working groups, and we are soliciting ideas and organizers. If you would like to propose a working group, please contact one of the organizers.

ASSOCIATED USER GROUP AND SOLICITATION FOR USER GROUPS

The meeting organizers have been approached by the Maestro/Tilera user group about holding one of their twice-yearly meetings in conjunction with the space computing conference. The organizers are soliciting other communities of interest that may be interested in meeting in conjunction with the meeting.

ATTENDENCE AND REGISTRATION FEE

Attendance is by invitation only. If you are in the industry and would like an invitation, please call Erik DeBenedictis (505) 284-4017 or e-mail
erikdebenedictis@sandia.gov. We are charging a $120 registration fee (but see next paragraph). This fee has been set to cover the cost of food due principally to gifting regulations pertaining to government participants. Register at the Sandia Webpay website at https://cfwebprod.sandia.gov/cfdocs/ccpwa/ and selecting "Fault-Tolerant Spaceborne Computing" as the event name.

We are senstitive to federal budget issues. If payment of a registration fee creates difficulties, please call Erik DeBenedictis (505) 284-4017 or e-mail erikdebenedictis@sandia.gov and we will work out alternative arrangements.

SENSITIVE INFORMATION

The meeting will include information at various levels of sensitivity.

FOREIGN NATIONALS

Foreign nationals will require a badge to enter DOE facilities. Foreign nationals should contact the conference sponsors immediately about a badge and should plan on stopping at the Sandia badge office about 1/2 mile away before first entering DOE premises.

ACCOMMODATIONS

The associated hotel is is the Sheraton at Menaul and Lousiana (same as the past few years). Please go to this website: https://www.starwoodmeeting.com/Book/FAULTTOLERANTSPACEBORNECOMPUTING or Call the Sheraton directly 800-325-3535. Group name "Fault-Tolerant Spaceborne Computing." Rate: $81 per night.

DIRECTIONS

The meeting will be held at several locations:

POINTS OF CONTACT

Document date April 29, 2013.