Aeroflex has been providing microprocessors to the Aerospace and Defense community for over 25 years. We begin with a radiation hardened 1750 / RISC in 1990, introduced a 80196, and more recently completed QML V qualification of a SPARC based LEON3-FT processor, our UT699. Aeroflex has begun development work on our next generation processor roadmap in conjunction with our sister facility, Aeroflex Gaisler in Sweden. Aeroflex will elaborate on the key features and operating enhancements being introduced with a multi-core LEON4 FT architecture. Also discussed will be the tool suite, applications support and board products to support our next generation processors.
Biography
Elaine Gonsalves has been Aeroflex Colorado Springs Business Development Manager for Standard Products for two year and was formally a Field Applications Engineer for the company over ten years ago. During her hiatus from Aeroflex, she worked as a Telecom Specialist for Dallas Semiconductor-Maxim. Other positions that she's held include Reliability Engineer and Component Failure Analyst at both commercial and defense companies, including Raytheon's Equipment Division. Elaine has a BSEE and MSEE from Worcester Polytechnic Institute in Worcester, MA.
Document date May 13, 2011.